The EMLC2009 Steering(*) and Program Committee of the 25th European Mask and Lithography Conference, EMLC 2009

Co-Conference Chair   Mr. B. Grenon, Brian Consulting, Colchester, VT, USA
                                          Naoya Hayashi (*), DNP, Saitama, Japan

Program Chairs            Dr. W. Maurer (*), InfineonTechnologies AG, Munich, Germany
                                          Mr. J. Waelpoel (*), ASML, Veldhoven, The Netherlands

Co-Program Chair        Mr. W. Montgomery, CNSE assignee at SEMATECH, Albany, NY, USA

Dr. M. Arnz	Carl Zeiss SMT AG, Oberkochen, Germany
Mr. P Chen	Taiwan Mask Corp., Hsinchu, Taiwan
Mr. B. Eynon	Samsung assignee at SEMATECH, Albany, NY, USA
Mr. C. Gale	Applied Materials, Dresden, Germany
Dr. A. C. Hourd	Compugraphics International Ltd., Glenrothes, Scotland
Mr. R. Jonckheere	IMEC, Leuven, Belgium
Dr. C. K. Kalus	Synopsys GmbH, Aschheim, Germany
Mr. H. Lehon	KLA-Tencor Corporation, San Jose, CA, USA
Dr. H. Loeschner	IMS Nanofabrication AG, Vienna, Austria
Mr. B. Naber	Cadence Design Systems Inc., San Jose, USA
Mr. P. Nikolsky	ASML, Veldhoven, The Netherlands
Dr. Ch. Pierrat	Cadence Design Systems Inc., San Jose, USA
Mr. T. Pratt	KLA-Tencor Corporation, USA
Dr. C. Reita	CEA-LETI, Grenoble, France
Dr. C. Romeo	ST-Microelectronics, Agrate Brianza, Italy
Prof. Dr. H.-C. Scheer	University of Wuppertal, Germany
Dr. R. Schnabel (*)	VDE/ VDI- GMM, Frankfurt, Germany
Mrs. I. A. Stolberg	Vistec Semiconductor Systems GmbH, Jena, Germany
Dr. S. Tedesco	CEA-LETI, Grenoble, France
Mr. M. Tissier	Toppan Photomasks S.A., Rousset, France
Mr. G. Unger	Qimonda Dresden GmbH, Dresden, Germany
Mr. J. Whittey	Vistec Semiconductor Systems, Oakdale, USA
Mr. H. Wolf	Photronics MZD GmbH, Dresden, Germany
Mr. L. Zurbrick	Agilent Technologies Inc., San Jose, CA, USA